Wire Bonders such as Automatic Ball Bonders, Manual Wedge Bonders, Wire Bonding, Automatic Wedge Bonders, Manual Ball Bonders. ASM EAGLE339 SERIES HIGH SPEED AUTOMATIC BALL BONDER: The Eagle is designed to meet today's equipment needs for higher speed production of more. Typing Teacher.

Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder. The most competitive 4 types:thin aluminum wire wedge bonder (25-75um aluminum wire);Wire wedge bonder (25-125um aluminum wire); heavy aluminum wire wedge bonder(75-500um aluminum wire);gold wire ball bonder (17-50um gold wire). They are very popular for samll quantity production, school,institution,research department. And the 3 automatic: automatic thin aluminum wire bonder (18-50um aluminum wire); automatic ball bonder (15-50um Au or alloy wire); automatic heavy wire bonder (125-500um Aluminum wire). 1: Thin wire bonder MDB-2575: Application: Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Specification: 1,electric requirement:220VAC±10%,50HZ,be sure connected to ground 2,wire diameter:25 ~75μm 3,ultrasonic power:0 -3W, two channel. Can be set separately of the two point 4,bond time:5 -200ms,two channel 5,bond force:10 -60g,two channel 6, span between first bond to second bond by automatic mode:0-10mm(motorized) 7,bond radian: 0-6mm(motorized) 8, jig moving area: Φ16mm 9,mouse hand:20*20mm 10,digital camera: optional 11,dimension:600*560*390mm 12,weight:36kg 2, Wire wedge bonder MDB-25125. Application: Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor etc. Specification: 1,electric requirement:220VAC±10%,50HZ,be sure connected to ground 2,wire diameter:25~125μm 3,ultrasonic power:0-5W, two channel.

Can be set separately of the two point 4,wire cutting:can set cut or no cut. 5,bond time:10-200ms,two channel 6,bond force:30-1000g,two channel 7, span between first bond to second bond by automatic mode:0-9mm(motorized) 8,bond radian: 0-6mm(motorized) 9, jig moving area: Φ16mm 10,mouse hand:20*20mm 11,digital camera: optional 12,dimension:600*560*390mm;weight:28kg 3:Heavy wire bonder MDB-7550: Application. Jetzt Lerne Ich C Pdf. High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc. Specification: 1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 2,aluminium wire diameter:75~500μm (3~20mil) 3,ultrasonic power:0-30W, two channel.can be set separately of the two point 4,bond time:10-500ms,two channel 5,bond force:30-1200g,two channel 6,motorized Y:0-18mm 7,microscope rate:7.5 and 15 8,working area:Φ25mm 9,light:adjustable brightness 10,size:620×610×560mm 11,weight:~40kg 4:Gold wire ball bonder MDBB-1750.